Int-TAR: An Intelligent Thermal-Aware Routing Algorithm for 3D NoC

Shirmohammadi, Z.; Mahmoudi, M.; Rostamnezhad, M.

doi:10.22061/jecei.2021.7750.428

Document Type : Original Research Paper

Authors

¹ Department of Computer Systems Architecture, Faculty of Computer Engineering, Shahid Rajaee Teacher Training University, Tehran, Iran

² Department of Computer Engineering, Khajeh Nasir Toosi University of Technology, Tehran, Iran

³ Department of Computer Engineering, Sharif University of Technology, Tehran, Iran

https://doi.org/10.22061/jecei.2021.7750.428

Abstract

Background and Objectives: Thermal problem is one of the main challenges in 3D on-chip networks. Inappropriate traffic distribution, poor heat dissipation, cooling restriction for layers away from the chip heatsink are the main reasons for this problem.
Methods: This paper proposes a new intelligent routing algorithm called (Int-TAR) to solve these problems. Int-TAR applies a routing for managing the heat in 3D on-chip networks dynamically. The main idea behind Int-TAR is to save the past states of the system and, according to these states, predict the future behavior of the network and perform routing dynamically. It is done by the threshold of routers dynamically based on the current status of the routers.
Result: The simulation results show that Int-TAR decreases the temperature of the network by 13% and improves performance efficiently.
Conclusion: The proposed idea shows the better benchmark for the thermal problem in 3D on-chip network. Also, the higher memory for storing the past state of the network can make accurate and the further performance for the network.

Keywords

20.1001.1.23223952.2022.10.1.5.8

Main Subjects

Hardware

Open Access

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Publisher

Shahid Rajaee Teacher Training University

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Journal of Electrical and Computer Engineering Innovations (JECEI)

Int-TAR: An Intelligent Thermal-Aware Routing Algorithm for 3D NoC

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Volume 10, Issue 1
January 2022
Pages 47-56

Int-TAR: An Intelligent Thermal-Aware Routing Algorithm for 3D NoC

References

References

Send comment about this article

Volume 10, Issue 1January 2022Pages 47-56

Volume 10, Issue 1
January 2022
Pages 47-56